Intel 'Lakefield' Gives Details of CPUs With 4 + 1 Cores For Surface Neo

Intel 'Lakefield' Gives Details of CPUs With 4 + 1 Cores For Surface Neo

For the first time, Intel has given details of its new energy-saving Core i3 and Core i5 processors, which come with a design adapted from the ARM world. The chips connect four energy-saving cores with a high-end core and are supposed to work more energy-efficiently.
The semiconductor giant had already announced the new chips of the "Lakefield" family last year and also promised that it would adopt the "big.LITTLE" concept known from ARM chips for the first time, that is, power-saving and powerful computing cores in one system -On-chip design united. Now Intel has officially made the first two SoCs of the "Lakefield" family official.

Intel CPUs with 4 + 1 x86 cores for the first time

It starts with the Intel Core i3-L13G4 and the Intel Core i5-L16G7, which each have a total of five x86 cores and should work with a power loss of up to seven watts. The main difference between the two SoCs is the clock speeds of the computing cores and the number of computing units of the integrated Intel UHD Graphics Gen11-LP graphics unit.
While the Intel Core i3-L13G4 has a high-end core with the code name "Sunny Cove" with a base clock of 800 megahertz and a maximum boost frequency of 2.8 gigahertz, as well as four energy-saving Atom "Tremont" cores the Intel Core i5-L16G7 has a "Sunny Cove" core with a 1.4 GHz base clock and a maximum 3.0 GHz boost clock. The all-core turbo boost is given as 1.3 and 1.8 gigahertz.
Intel's own GPU has 48 EUs for the i3 chip, while the i5 model has 68 graphics cores. In both cases, a maximum of eight gigabytes of RAM are supported, which, like smartphones, are installed in a "package-on-package" design. The SoC and the main memory are put directly on top of each other and thus "stacked", which enables a more compact design but also excludes an upgrade.

CPU and RAM are stacked

The new "Lakefield" SoCs are also different in their external design than previous Intel processors. They are in a 12x12 millimeter chip that is only one millimeter thick. In this regard, too, the focus is on smartphones, for which such a design has long been standard.
The new Intel chips support flash memory via UFS 3.0 and PCIe NVMe. USB Type-C and up to six PCIe Gen 3.0 lanes are also offered. With a minimum power consumption of 2.5 milliwatts in standby mode, the new SoCs can run extremely energy-efficiently if you switch off the display of the devices equipped with them - without shutting down the respective system yourself.
The first products with the new Intel "Lakefield" chips are the Lenovo ThinkPad X1 Fold and the Samsung Galaxy Book S in the Intel version. In both cases, an introduction has been announced this year or "from June". Microsoft wants to use the new chips in its dual-screen tablet Surface Neo, among other things, which will probably not be on the market until 2021.
With the new chips, Intel is competing directly with the Snapdragon 8cx and other high-end ARM SoCs, such as those found in the Surface Pro X. An advantage on the part of the US group is that the devices running with the new "Lakefield" SoCs support all x86 applications for Windows 10 without any restrictions.

(Photo Credit:- Microsoft)